Silicon wafers are zapped with ions , which form tiny islands with either an excess or a dearth of electrons 矽晶圆用离子轰击，而在其上形成微小的岛，各自具有过量或是不足的电子。
In this process , a standard stencil printing technique is used to print solder paste directly onto silicon wafers ( figure 4 ) 在这个过程，标准印刷技术用来把锡膏直接印刷到硅晶片上。
Bonded wafers - two silicon wafers that have been bonded together by silicon dioxide , which acts as an insulating layer 绑定晶圆片-两个晶圆片通过二氧化硅层结合到一起，作为绝缘层。
Bonded wafers - two silicon wafers that have been bonded together by silicon dioxide , which acts as an insulating layer 绑定晶圆片-两个二过通片圆晶氧化硅层结合到一起，作为绝缘层。
Txrf surface chemical analysis - determination of surface elemental contamination on silicon wafers by total - reflection x - ray fluorescence spectroscopy 表面化学分析.用总反射x -射线荧光
Stress - strain curves were also analyzed at high temperatures . the warpage of silicon wafer of ncz and cz silicon were investigated 实验中对常温及高温下的应力-应变曲线以及也进行了分析。
Research progresses in recent 10 years in metallic microcontamnation of silicon wafer during wet cleaning are briefly reviewed 摘要综述了近10年来国内外在半导体矽片金属微观污染研究领域的进展。
The plant would be able to produce chipsets with details as fine as 90 nanometres across on 300mm silicon wafers , the ndrc said 国家发改委表示，大连工厂将能在300毫米晶圆片上，制造精度高达90纳米的芯片组。
Metal contamination in a silicon wafer is unavoidable during the many steps required for the fabrication of microelectronics devices 在集成电路和半导体器件的生产过程中，许多工序都可能使硅片受到金属的污染。
Silicon grating is a period construction fabricated on the silicon wafer by micro fabrication techniques as ultraviolet lithography and anisotropic etching 硅光栅是利用紫外光刻、各向异性腐蚀等硅微加工技术在硅片上制作的周期结构。
